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Vehicle hybrid,
electric vehicle battery pack management system (BMS) signal waterproof
connector. It is suitable for real-time monitoring, fault diagnosis, SOC
estimation, mileage estimation, short circuit protection, leakage detection,
display alarm, charging and discharging mode selection of the parameters of the
power integrated battery of the battery pack of the electric vehicle, as well
as the signal connection with the vehicle integrated controller or the charging
motor for information exchange through the way of CANbus, which is electric,
waterproof and vibration proof connector.
The structure of
the utility model is composed of a screw cap splicing type socket and a plug;
Nut clamping socket includes nut clamping socket shell, connecting clamp cap,
plastic dust cover, wave ring, anti jump ring, connecting clamp cap retaining
ring, crimping Jack insulator, crimping jack assembly, cable cover shell,
rubber sealing ring, plastic dust cover, shell retaining ring, O-type rubber
ring, gasket, stop gasket, hexagon clamping cap, cable sheath, clamp plate and
welding plug The plug consists of a plug housing, a plug housing retaining ring
and a waterproof tail accessory part.
In practical
application, aiming at the corrosion phenomenon of the gold-plated brass
connecting piece of a battery pack connector in the process of damp heat test,
the material of the connecting piece and the process design of the battery pack
are analyzed. The results show that the corrosion of the connecting piece is
mainly due to the poor quality of the surface coating, partial or even missing
plating, and insufficient thickness;
Another reason is
that the encapsulation glue of the battery pack may release phosphoric acid
substances under high temperature and high humidity, which may induce the
corrosion of the connector. Finally, a series of suggestions are put forward
for the quality control of the connector according to the above reasons: the
first improvement of the electrodeposited coating is changed from the initial
brass substrate with nickel bottom of 50 micromm and gold plating of 1 micromm
to the copper substrate with nickel bottom of 100 micromm - increase the
activation of the bottom and gold plating of 2 micromm. The composition of the
package glue is improved, and the phosphoric acid mixture which is easy to
release gas is changed into the glue without gas release.